
As electronic devices become smaller and lighter in weight, the component mounting density increases, with the result that heat dissipation performance decreases, causing the device temperature to rise easily. In particular, heat generation from the power output circuit elements greatly affects the temperature rise of devices.. . In order to measure the heat-generation characteristics of a capacitor, the capacitor temperature must be measured in the condition with heat. . Heat-generation characteristics data can be checked at the Murata website. Figure 5 shows the window of the "SimSurfing" design assistance tool provided by Murata Manufacturing. Characteristics can be displayed by selecting the. [pdf]
If the ESR and current are known, the power dissipation and thus, the heat generated in the capacitor can be calculated. From this, plus the thermal resistance of the ca-pacitor and its external connections to a heat sink, it be-comes possible to determine the temperature rise above ambient of the capacitor.
The temperature rise of the core is directly proportional to the core-to-ambient thermal re-sistance, and this paper models this thermal resistance for various capacitor construction techniques. Results are adapted for use in a new, lumped-parameter model suitable for use in a spreadsheet or a Java applet.
2. Heat-generation characteristics of capacitors In order to measure the heat-generation characteristics of a capacitor, the capacitor temperature must be measured in the condition with heat dissipation from the surface due to convection and radiation and heat dissipation due to heat transfer via the jig minimized.
Once the effective thermal resistance from the core to the ambient is known, the thermal time constant of the capacitor may be calculated by lumped-parameter analysis if the Biot number Bi is much less than unity : Bi ” hL / k « 1 . » 100 W/m·K , Bi < 0.2 and condition (42) is met for low and moderate air velocities and no heatsink.
A capacitor’s transient core temperature response to step increase or decrease in ambient temperature DT is determined, subject to (42), by appealing to a DC electrical circuit model analogy. The model is of a ca-pacitor transient voltage response to a DC voltage source being switched at t=0 to a series RC circuit. See Fig. 5. By inspection, 0 !
As previously stated, the allow-able power dissipation can be determined by the knowledge of the thermal resistance Θcap, the equivalent series resistance ESR of the capacitor, the maximum allowable internal temperature and the maximum temperature that solder or epoxy on the ter-mination can tolerate without destruction.
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